HIGH TEMPERATURE RESISTANT ANTISTATIC PRESSURE-SENSITIVE ADHESIVE TAPE

• Main Authors: GUTMAN, GUSTAV, YAU, STEVEN, D
• Format: Patent
• Language: English; French; German
• Published: 23.06.1999
• Edition: 6
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

A heat-resistant anti-static pressure-sensitive adhesive tape comprising a substrate having coated thereon an acrylic microparticulate adhesive having an average diameter of at least about 1 micrometer, wherein the microparticles have a surface bearing thereon a conductive material formed from a polymer electrolyte base polymer, and at least one ionic salt selected from the group consisting of salts of alkali metals and salts of alkaline earth metals, and at least one thermal stabilizer selected from the group consisting of hindered amines, salts of substituted toluimidazoles, and mixtures thereof, said substituted toluimidazoles having the formula: wherein R1 is selected from the group consisting of hydrogen, a methyl group, an ethyl group and a propyl group, R2 is selected from the group consisting of hydrogen, a methyl group and an ethyl group, M is a metal, and x is an integer selected from 1 or 2 with positive or negative identity being dependent on the valence of the metal, said adhesive being adhered to said substrate by means of a primer, said primer comprising at least one phenolic resin, at least one rubbery compound, and at least one of said thermal stabilizers, said adhesive tape being capable of surviving immersion in molten solder at 260 DEG C. for at least about 5 seconds.