LEAD-FREE SOLDER

A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt% of Zn; at least one of from 0.01 to 1 wt% of Ni, from 0.1 to 3.5 wt% of Ag, and from 0.1 to 3 wt% of Cu; optionally at least one of from 0....

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Main Authors TAGUCHI, TOSHIHIKO, OISHI, RYO, KISHIDA, SADAO, HORI, TAKASHI, MURATA, TOSHIKAZU, NOGUCHI, HIROJI, ASANO, SHOZO
Format Patent
LanguageEnglish
French
German
Published 29.07.1998
Edition6
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt% of Zn; at least one of from 0.01 to 1 wt% of Ni, from 0.1 to 3.5 wt% of Ag, and from 0.1 to 3 wt% of Cu; optionally at least one of from 0.2 to 6 wt% of Bi, from 0.5 to 3 wt% of In, and from 0.001 to 1 wt% of P; and a balance of Sn. Another such lead-free solder alloy consists essentially of: from 2 to 10 wt% of Zn; from 10 to 30 wt% of Bi; from 0.05 to 2 wt% of Ag; optionally from 0.001 to 1 wt% of P, and a balance of Sn. These solder alloys have a tensile strength of at least 5 kgf/mm and at least 10% elongation.
Bibliography:Application Number: EP19960931990