Improved wiring structure for high performance chips
The present invention relates to a new wiring structure for electronic components, particularly chips. The inventive wiring structure is distinguished over the state of the art in that each wiring direction of each metal layer is arranged rotated compared with each other wiring direction of another...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
17.06.1998
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a new wiring structure for electronic components, particularly chips. The inventive wiring structure is distinguished over the state of the art in that each wiring direction of each metal layer is arranged rotated compared with each other wiring direction of another metal layer which lies in a relevant interference coupling region, by a certain angle alpha . The present invention is thus particularly suitable for application to high performance chips with seven or more layers, since here, because of the reduction of the distances between the individual layers of wiring, large interference voltages can appear. The wiring structure in accordance with the invention also leads to the shortening of conductors, whereby the processing speed of the chip is clearly improved. |
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Bibliography: | Application Number: EP19970117268 |