Improved wiring structure for high performance chips

The present invention relates to a new wiring structure for electronic components, particularly chips. The inventive wiring structure is distinguished over the state of the art in that each wiring direction of each metal layer is arranged rotated compared with each other wiring direction of another...

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Bibliographic Details
Main Authors KLINK, ERICH, KOEHL, JUERGEN, KORTE, BERNHARD, DR, FOLBERTH, HARALD
Format Patent
LanguageEnglish
French
German
Published 17.06.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention relates to a new wiring structure for electronic components, particularly chips. The inventive wiring structure is distinguished over the state of the art in that each wiring direction of each metal layer is arranged rotated compared with each other wiring direction of another metal layer which lies in a relevant interference coupling region, by a certain angle alpha . The present invention is thus particularly suitable for application to high performance chips with seven or more layers, since here, because of the reduction of the distances between the individual layers of wiring, large interference voltages can appear. The wiring structure in accordance with the invention also leads to the shortening of conductors, whereby the processing speed of the chip is clearly improved.
Bibliography:Application Number: EP19970117268