PRESSURE-SENSITIVE ADHESIVE TAPES FOR ELECTRONICS APPLICATIONS

• Main Authors: GUTMAN, GUSTAV, YAU, STEVEN, D
• Format: Patent
• Language: English; French; German
• Published: 07.10.1998
• Edition: 6
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INSULATORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NATURALLY-OCCURRING ELECTRICITY; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; STATIC ELECTRICITY; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES; WORKING-UP

A water-resistant, anti-static pressure-sensitive adhesive tape suitable for use as a wafer dicing tape comprising a flexible substrate having opposing surfaces, at least one surface bearing thereon a removable, aziridine-crosslinked microparticulate adhesive comprised of microparticles having a surface bearing thereon an ionic conductive material formed from a polymer electrolyte base polymer, and at least one ionic salt selected from the group consisting of salts of alkali metals and salts of alkaline earth metals, wherein said microparticles have an average diameter of at least about 1 micrometer, said adhesive having an adhesion to steel of from about 0.5 Newtons/100 mm (N/100 mm) to about 10 N/100 mm.