An aqueous acid bath for the electrodeposition of a shiny and tear-free copper coating and its application

An aqueous acidic bath for the galvanic precipitation of lustrous copper layer containing at least one copper salt, at least one inorganic acid and, if required a chloride, as well as a compound with an amide group, an organic thio-compound with groups to make it water soluble and, if required an ox...

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Bibliographic Details
Main Author DAHMS, WOLFGANG
Format Patent
LanguageEnglish
French
German
Published 05.01.2000
Edition7
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:An aqueous acidic bath for the galvanic precipitation of lustrous copper layer containing at least one copper salt, at least one inorganic acid and, if required a chloride, as well as a compound with an amide group, an organic thio-compound with groups to make it water soluble and, if required an oxygen containing high molecular mass organic compound. The compound with an amide group is a lactam-alkoxylate, which may be substituted if required.
Bibliography:Application Number: EP19970200458