Electroplating process

A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an unstable aqueous dispersion essentially free of a dispersing agent using physical dispersion means to maintain the stabili...

Full description

Saved in:
Bibliographic Details
Main Authors FLORIO, STEVEN M, COLANGELO, CARL J, COUBLE, EDWARD C, KAPECKAS, MARK J, BURRESS, JEFFREY P
Format Patent
LanguageEnglish
French
German
Published 05.03.2003
Edition7
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an unstable aqueous dispersion essentially free of a dispersing agent using physical dispersion means to maintain the stability of the dispersion.
Bibliography:Application Number: EP19960114640