Semiconductor power module with connection pins
The semiconductor module has a housing with a housing wall (2) and a base (1) supporting a number of semiconductor elements (5). The housing wall has externally projecting terminal pins (9) provided by the upper part of a connection lead (7) which is coupled to the semiconductor element on the insid...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
18.07.2007
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Subjects | |
Online Access | Get full text |
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Summary: | The semiconductor module has a housing with a housing wall (2) and a base (1) supporting a number of semiconductor elements (5). The housing wall has externally projecting terminal pins (9) provided by the upper part of a connection lead (7) which is coupled to the semiconductor element on the inside of the housing. The part of the connection lead on the inside of the housing has a rectangular cross-section, with a greater cross-sectional surface than the sum of the cross- sections of the terminal pins. |
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Bibliography: | Application Number: EP19960108534 |