ADHESION QUANTITY REGULATION METHOD BY GAS WIPING

• Main Authors: ANDACHI, KAZUNARI, SHIGEMOTO, HARUMI
• Format: Patent
• Language: English; French; German
• Published: 03.01.2001
• Edition: 7
• Subjects: APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING

Relational formulas for determining an adhesion quantity of a coating material are separately set in accordance with a relative relation between a nozzle-strip gap D and a nozzle slit gap B, and the adhesion quantity of the coating material is accurately regulated over a broad operation range using the relational formulas. A nozzle pressure P and a strip speed V are controlled, and D is controlled using the formula (1): W = h1 x rho M x ä(K- 1)/(2x eta xKxPA)ü<1/2> x D<1/2> x Ä mu xV/ä(P/PA) <1)/K>-1)Ü<1/2>, when D/B </= C (expansion region). When D/B > C (complete development region), on the other hand, at least one of D and B is controlled using the formula (2): W = h2 x rho M x ä(K-1)/(2x eta xKxPA)ü<1/2> x (D/B<1/2>)xÄ mu x V/ä(P/PA)<(K-1)/K>-1üÜ<1/2>, so as to regulate the adhesion quantity of a molten metal (coating material) ( rho M: density of molten metal, mu : viscosity of molten metal, PA: pressure at nozzle outlet, eta : nozzle efficiency, K: specific heat ratio of gas, h1 and h2: constants).