METHOD FOR MACHINING MATERIALS BY DIODE RADIATION

PCT No. PCT/EP94/00706 Sec. 371 Date Nov. 17, 1995 Sec. 102(e) Date Nov. 17, 1995 PCT Filed Mar. 8, 1994 PCT Pub. No. WO94/26459 PCT Pub. Date Nov. 24, 1994The invention relates to a process for material treatment with diode radiation, especially laser diode radiation. To match the radiation profile...

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Bibliographic Details
Main Authors KRAUSE, VOLKER, WISSENBACH, KONRAD, BEYER, ECKHARD
Format Patent
LanguageEnglish
French
German
Published 13.08.1997
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
DEVICES USING STIMULATED EMISSION
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PCT No. PCT/EP94/00706 Sec. 371 Date Nov. 17, 1995 Sec. 102(e) Date Nov. 17, 1995 PCT Filed Mar. 8, 1994 PCT Pub. No. WO94/26459 PCT Pub. Date Nov. 24, 1994The invention relates to a process for material treatment with diode radiation, especially laser diode radiation. To match the radiation profile to the treatment process, the process is so carried out that radiation emitted from a multiplicity of diodes is directed with a predetermined radiation profile upon the treated region of the workpiece and that a change in the intensity distribution in the radiation profile is effected by controlling the diode output power.
Bibliography:Application Number: EP19940911123