FORMING A LAYER

A chamber includes a door which opens to introduce a workpiece into the chamber and which closes to enclose the workpiece within the chamber. A workpiece support is located within said chamber and supports the workpiece such that a coated surface of the workpiece faces in a given direction. A liquid...

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Bibliographic Details
Main Author DOBSON, CHRISTOPHER, DAVID
Format Patent
LanguageEnglish
French
German
Published 16.07.1997
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A chamber includes a door which opens to introduce a workpiece into the chamber and which closes to enclose the workpiece within the chamber. A workpiece support is located within said chamber and supports the workpiece such that a coated surface of the workpiece faces in a given direction. A liquid supply mechanism floods the chamber with a liquid to immerse the workpiece support. A pressure pulse supply mechanism applies a pulse of pressure to the liquid such that the pulse of pressure is transmitted through the liquid in a direction opposite the given direction. The pulse of pressure is incident via the liquid on the coated surface of the workpiece supported by the workpiece support.
Bibliography:Application Number: EP19950907759