A METHOD OF COMPLIANTLY MOUNTING A PIEZOELECTRIC DEVICE
A method of compliantly mounting piezoelectric device with a substrate. First, outer portions of a piezoelectric element are selectively metallized. Next, one layer of aluminum is selectively dispensed on the piezoelectric element. Third, an uncured conductive compliant material is placed and aligne...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
06.05.1999
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | A method of compliantly mounting piezoelectric device with a substrate. First, outer portions of a piezoelectric element are selectively metallized. Next, one layer of aluminum is selectively dispensed on the piezoelectric element. Third, an uncured conductive compliant material is placed and aligned on a substrate. Fourth, the piezoelectric element is placed and aligned on the conductive compliant material, such that upon curing the conductive compliant material forms a compliant mount connecting the outer metallized portions of the piezoelectric element with the substrate. |
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Bibliography: | Application Number: EP19950903140 |