Manufacturing process for a hybrid card
The card manufacture commences with laying of the antenna (5) on a thermoplastic layer on the card body. The antenna is in the shape of a spiral with terminals to one end of the card. The antenna layer is then covered by a substantial top layer of plastic. A cavity (17) is then formed in the top lay...
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Main Author | |
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Format | Patent |
Language | English French German |
Published |
01.10.2003
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Summary: | The card manufacture commences with laying of the antenna (5) on a thermoplastic layer on the card body. The antenna is in the shape of a spiral with terminals to one end of the card. The antenna layer is then covered by a substantial top layer of plastic. A cavity (17) is then formed in the top layer of the card (2) with a milling cutter. The cavity is deep enough to expose the terminals (15) of the antenna (5). The electronic module is positioned in the cavity, and fixed in place before the cavity is filled. |
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Bibliography: | Application Number: EP19950400305 |