Substrate-embedded pluggable receptacles for connecting clustered optical cables to a module

Each connector connects a cluster of optical fibres in a small dimension of space on the module. The optical-fibre cluster connectors are embedded in indentations around the edges of a multilayer glass/ceramic (MLGC) multi-chip module (MCM), which may be a thermal conduction module (TCM). Receptacle...

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Bibliographic Details
Main Authors JACOBOWITZ, LAWRENCE, ECKER, MARIO ENRIQUE, DECUSATIS, CASIMER MAURICE
Format Patent
LanguageEnglish
French
German
Published 23.08.1995
Edition6
Subjects
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Summary:Each connector connects a cluster of optical fibres in a small dimension of space on the module. The optical-fibre cluster connectors are embedded in indentations around the edges of a multilayer glass/ceramic (MLGC) multi-chip module (MCM), which may be a thermal conduction module (TCM). Receptacle and plug assemblies hold the fibres in respective key V-grooves etched in silicon members which carry and interlock each fibre in each receptacle. Alignment and locking device is provided in each connector for aligning a plug's array of fibres with corresponding receptacle fibres in one or more angled groove(s) in a receiving receptacle. Thermal coefficients of expansion match between the silicon receptacle and the glass-ceramic substrate to guarantee the preservation of opto-mechanical alignments.
Bibliography:Application Number: EP19940110742