Substrate-embedded pluggable receptacles for connecting clustered optical cables to a module
Each connector connects a cluster of optical fibres in a small dimension of space on the module. The optical-fibre cluster connectors are embedded in indentations around the edges of a multilayer glass/ceramic (MLGC) multi-chip module (MCM), which may be a thermal conduction module (TCM). Receptacle...
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
23.08.1995
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Summary: | Each connector connects a cluster of optical fibres in a small dimension of space on the module. The optical-fibre cluster connectors are embedded in indentations around the edges of a multilayer glass/ceramic (MLGC) multi-chip module (MCM), which may be a thermal conduction module (TCM). Receptacle and plug assemblies hold the fibres in respective key V-grooves etched in silicon members which carry and interlock each fibre in each receptacle. Alignment and locking device is provided in each connector for aligning a plug's array of fibres with corresponding receptacle fibres in one or more angled groove(s) in a receiving receptacle. Thermal coefficients of expansion match between the silicon receptacle and the glass-ceramic substrate to guarantee the preservation of opto-mechanical alignments. |
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Bibliography: | Application Number: EP19940110742 |