Heat sink for a semiconductor device

A heat sink (13) is attached to a semiconductor element (11) functioning as an exothermic element, which is mounted on a circuit board (15) and has a predetermined allowable power consumption, thereby cooling the semiconductor element (11). A semiconductor element (12) having a lower allowable power...

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Bibliographic Details
Main Authors HIRANO, NAOHIKO, YAMAJI, YASUHIRO
Format Patent
LanguageEnglish
French
German
Published 03.03.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A heat sink (13) is attached to a semiconductor element (11) functioning as an exothermic element, which is mounted on a circuit board (15) and has a predetermined allowable power consumption, thereby cooling the semiconductor element (11). A semiconductor element (12) having a lower allowable power consumption than the semiconductor element (11) having the predetermined power consumption, which is hardly exposed to a cooling air flow cooled via the heat sink (13), is connected to a heat conductive auxiliary member (14) connected at one end to the heat sink (13). Thus, the heat radiation efficiency of the semiconductor element (12) having the lower allowable power consumption is enhanced.
Bibliography:Application Number: EP19930121029