Connections arrangement for semiconductor devices

An arrangement for making fatigue-free external connections to a device (4,5) mounted on a direct copper bonded substrate, in which one or more connector tubes (6) are brazed to respective copper areas (2) on the substrate before the device (4,5) is mounted on the substrate, and external connections...

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Bibliographic Details
Main Author DICKENSON, ROBERT JAMES
Format Patent
LanguageEnglish
French
German
Published 05.10.1994
Edition5
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:An arrangement for making fatigue-free external connections to a device (4,5) mounted on a direct copper bonded substrate, in which one or more connector tubes (6) are brazed to respective copper areas (2) on the substrate before the device (4,5) is mounted on the substrate, and external connections are made by soldering leads (8) or bus bars (9) into the tubes (6).
Bibliography:Application Number: EP19940301643