Elimination of local loading effect in dielectric planarization

Local loading effects are reduced in a planarizing etchback of a dielectric layer by using a plasma comprising SF6.

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Bibliographic Details
Main Authors ALUGBIN, DAYO, OLASUPO, KOLAWOLE RAHMAN, MARTIN, EDWARD PAUL, KORNBLIT, AVINOAM
Format Patent
LanguageEnglish
French
German
Published 27.07.1994
Edition5
Subjects
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Summary:Local loading effects are reduced in a planarizing etchback of a dielectric layer by using a plasma comprising SF6.
Bibliography:Application Number: EP19930310123