Elimination of local loading effect in dielectric planarization
Local loading effects are reduced in a planarizing etchback of a dielectric layer by using a plasma comprising SF6.
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
27.07.1994
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Edition | 5 |
Subjects | |
Online Access | Get full text |
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Summary: | Local loading effects are reduced in a planarizing etchback of a dielectric layer by using a plasma comprising SF6. |
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Bibliography: | Application Number: EP19930310123 |