Method for integrated circuit fabrication including linewidth control during etching
Pattern transfer from a resist to an underlying layer is accomplished by etching the resist in a plasma comprising hydrogen bromide and oxygen.
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
06.07.1994
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Edition | 5 |
Subjects | |
Online Access | Get full text |
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Abstract | Pattern transfer from a resist to an underlying layer is accomplished by etching the resist in a plasma comprising hydrogen bromide and oxygen. |
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AbstractList | Pattern transfer from a resist to an underlying layer is accomplished by etching the resist in a plasma comprising hydrogen bromide and oxygen. |
Author | KORNBILT, AVINOAM KOOK, TAEHO OLASUPO, KOLAWOLE RAHMAN |
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DocumentTitleAlternate | Verfahren zur Herstellung integrierten Schaltungen mit Kontrolle der Linienbreitmessung in einer Strukturierungstufe. Procédé de fabrication de circuits intégrés avec contrÔle de la définition des motifs pendant la gravure. |
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Notes | Application Number: EP19930309855 |
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RelatedCompanies | AT&T CORP |
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Snippet | Pattern transfer from a resist to an underlying layer is accomplished by etching the resist in a plasma comprising hydrogen bromide and oxygen. |
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SubjectTerms | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CINEMATOGRAPHY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MATERIALS THEREFOR METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
Title | Method for integrated circuit fabrication including linewidth control during etching |
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