UV-light stabilized polyoxymethylene molding compositions

Thermoplastic moulding compositions containing A) from 40 to 99.69 % by weight of a polyoxymethylene homopolymer or copolymer B) from 0.1 to 2 % by weight of at least one stabiliser from the group consisting of benzotriazole derivatives or benzophenone derivatives or aromatic benzoate derivatives, C...

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Bibliographic Details
Main Authors ZEINER, HARTMUT, KIELHORN-BAYER, SABINE, GOERRISSEN, HEINER, SAENGER, DIETRICH
Format Patent
LanguageEnglish
French
German
Published 12.10.1994
Edition5
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:Thermoplastic moulding compositions containing A) from 40 to 99.69 % by weight of a polyoxymethylene homopolymer or copolymer B) from 0.1 to 2 % by weight of at least one stabiliser from the group consisting of benzotriazole derivatives or benzophenone derivatives or aromatic benzoate derivatives, C) from 0.1 to 2 % by weight of at least one sterically hindered amine compound, D) from 0.005 to 2 % by weight of a polyamide (nylon), E) from 0 to 2 % by weight of a compound containing epoxy groups, F) from 0 to 50 % by weight of an impact-modifying polymer, G) from 0 to 50 % by weight of a fibrous or particulate filler, or mixtures thereof.
Bibliography:Application Number: EP19930113732