Mechanical in situ curometer

An in situ curometer has been developed to follow the cure of thick articles during molding, by measuring continuously the dynamic mechanical properties (shear modulus and loss angle). The apparatus is designed to provide cure data on curable articles such as rubber products and components in situ,...

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Bibliographic Details
Main Authors GENT, ALAN NEVILLE, FIELDING-RUSSEL, GEORGE SAM, TALUG, AHMET
Format Patent
LanguageEnglish
French
German
Published 19.05.1999
Edition6
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PERFORMING OPERATIONS
PHYSICS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TESTING
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:An in situ curometer has been developed to follow the cure of thick articles during molding, by measuring continuously the dynamic mechanical properties (shear modulus and loss angle). The apparatus is designed to provide cure data on curable articles such as rubber products and components in situ, during the curing of the article, to improve manufacturing cure efficiencies. The curometer is a small-scale version of an Oscillating Disk Rheometer, designed to operate through a mold wall. An approximate theoretical treatment has been developed to relate the observed torque and loss angle to the dynamic properties of the rubber compound.
Bibliography:Application Number: EP19930110484