Ceramic via composition, multilayer ceramic circuit containing same, and process for using same

A novel metal filled via composition for co-firing with glass-ceramic material. The composition comprises a conductive first metal (copper), an oxidizable second metal (selected from the group consisting of iron, nickel and cobalt) and an organic medium in which said first and second metal are dispe...

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Bibliographic Details
Main Authors DIVAKARUNI, RENUKA SHASTRI, NATARAJAN, GOVINDARAJAN, REDDY, SRINIVASA S.N, SAMMET, MANFRED, CASEY, JON ALFRED
Format Patent
LanguageEnglish
French
German
Published 01.12.1993
Edition5
Subjects
ARTIFICIAL STONE
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CEMENTS
CERAMICS
CHEMISTRY
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LIME, MAGNESIA
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
REFRACTORIES
SEMICONDUCTOR DEVICES
SLAG
TREATMENT OF NATURAL STONE
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Summary:A novel metal filled via composition for co-firing with glass-ceramic material. The composition comprises a conductive first metal (copper), an oxidizable second metal (selected from the group consisting of iron, nickel and cobalt) and an organic medium in which said first and second metal are dispersed. The via composition has a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.
Bibliography:Application Number: EP19930480042