Embossing metal mold and manufacturing method thereof

According to the present invention, etching is used to form a concave and convex pattern corresponding to information (6) an embossing metal mold comprising a conductive layer (1) and a layer which includes an Ni electric-plating layer (2), or an Ni electric-plating layer (2), so that the surface of...

Full description

Saved in:
Bibliographic Details
Main Authors HORIGOME, SHINKICHI, KATO, KEIZO, ITO, MASARU, SUZUKI, RYO
Format Patent
LanguageEnglish
French
German
Published 03.06.1992
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:According to the present invention, etching is used to form a concave and convex pattern corresponding to information (6) an embossing metal mold comprising a conductive layer (1) and a layer which includes an Ni electric-plating layer (2), or an Ni electric-plating layer (2), so that the surface of the embossing metal mold will not be contaminated even if processing conditions are somewhat changed, and that the mold will have less defects. Thus, optical disk substrates of high quality can be produced. Besides, time required for manufacturing a stamper can be shortened.
Bibliography:Application Number: EP19910120182