High density internconnect

A pair of elongated rectangular metallic bumps are formed on two separate surfaces. The bumps are aligned orthogonally prior to being merged by hybridization to form a high density hybrid assembly. Translational misalignment does not change the interconnect area. Rotational misalignment causes only...

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Bibliographic Details
Main Author GATES, JAMES L
Format Patent
LanguageEnglish
French
German
Published 04.09.1991
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A pair of elongated rectangular metallic bumps are formed on two separate surfaces. The bumps are aligned orthogonally prior to being merged by hybridization to form a high density hybrid assembly. Translational misalignment does not change the interconnect area. Rotational misalignment causes only a slight change in the interconnect area. The bump surface area is increased by merging the bumps. This reduces the hybridization pressure which prevents the interconnect area from increasing in size, commonly known as mash out. The invention makes high density hybrid assemblies practical because it reduces the risk of short circuits between adjacent interconnects and results in a high yield in production.
Bibliography:Application Number: EP19910101954