Process for preparing printed circuit board having through-hole

• Main Authors: YODA, EIJI, OTSUKI, YUTAKA, YUASA, HITOSHI, SATO, HARUYOSHI, YAMASITA, YUKIO
• Format: Patent
• Language: English; French; German
• Published: 14.08.1991
• Subjects: ADHESIVES; APPARATUS SPECIALLY ADAPTED THEREFOR; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; CINEMATOGRAPHY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; CORRECTING FLUIDS; DIFFUSION TREATMENT OF METALLIC MATERIAL; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; FILLING PASTES; HOLOGRAPHY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; INKS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NATURAL RESINS; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; ORIGINALS THEREFOR; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; PRINTED CIRCUITS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING; USE OF MATERIALS THEREFOR; WOODSTAINS

A process for preparing a through-hole printed circuit board having at least one through-hole, involves the steps of: (a) applying an acid-soluble cationic electrodeposit photoresist by electrodeposition all over on a surface of a board covered by an electrically conductive metal layer including the through-hole, while setting the board as a cathode; (b) heating the board passed through the step (a) to a tempeature of 50 DEG C to 120 DEG C; (c) exposing the acid-soluble cationic electrodeposit photoresist to light through a photo-mask having a pattern complementary to a pattern of a circuit to be formed, thereby to cure the photoresist, and then developing with a developer to remove only an uncured portion of the photoresist; (d) applying an alkali-soluble anionic electrodeposit etching resist by electrodeposition on a surface of a portion of the electrically conductive metal layer uncoated with the cured photoresist, while setting the board passed through the step (c) as an anode; (e) heating the board passed through the step (d) to a tempeature of 50 to 120 DEG C; (f) removing a coating of the cured acid-soluble cationic electrodeposit photoresist with an aqueous acid solution; (g) etching a portion of the electrically conductive metal layer exposed by the step (f); and (h) removing the remaining alkali-soluble anionic electrodeposit etching resist with an aqueous alkali solution.