Liquid solder mask composition

Disclosed is a UV-curable, aqueous-developable liquid solder mask composition comprising (1) 40% to 70% of a non-reactive binder that is a film-forming random copolymer of (a) one or more (meth)acrylic alkyl ester monomers, at least one of which is an ester of a 4-12 carbon alkanol, (b) acrylic or m...

Full description

Saved in:
Bibliographic Details
Main Author VARNELL, DANIEL FELIX
Format Patent
LanguageEnglish
French
German
Published 02.05.1991
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
Online AccessGet full text

Cover

More Information
Summary:Disclosed is a UV-curable, aqueous-developable liquid solder mask composition comprising (1) 40% to 70% of a non-reactive binder that is a film-forming random copolymer of (a) one or more (meth)acrylic alkyl ester monomers, at least one of which is an ester of a 4-12 carbon alkanol, (b) acrylic or methacrylic acid, and optionally (c) styrene or alpha -methylstyrene, (2) 20% to 40% of one or more (meth)acrylic ester monomers containing two or more ethylenic double bonds, wherein at least one of the monomers has at least four ethylenic double bonds, (3) 1% to 5% of a photoinitiator, (4) 5% to 15% of a filler, all percentages being by weight based on the nonsolvent components of the composition, and (5) 35% to 70% of an organic solvent, based on the total weigt of the composition.
Bibliography:Application Number: EP19900120278