Apparatus and method for controlling the evaporated particle rate in an evaporation process

• Main Authors: WEGMANN, URS, KOLLER, ALBERT
• Format: Patent
• Language: English; French; German
• Published: 07.01.1998
• Edition: 6
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A method and apparatus for controlling, regulating and measuirng the particle mass which is evaporated per unit time from a target by a charged particle beam, in particular an electron beam, comprises the varying of an impingement area of the beam on the target in a manner which is decoupled from control of the position of the impingement area and control of the mass current of the beam. The impingment area may be modulated for varying the particle mass and the particle mass can be measured by also using a modulation step in conjunction with a particle detector and a beam modulation step.