Method of bonding gold or gold alloy wire to solder
A compression bond is formed between a gold or gold alloy wire (12) and a solder (16) such as lead/tin by forming a head (14) on the wire and forcing the head into a pad of the solder by thermosonic, or thermocompression, or ultrasonic compression bonding techniques. This forms a gold/solder interme...
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Main Authors | , , , , , |
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Format | Patent |
Language | English French German |
Published |
02.05.1990
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Subjects | |
Online Access | Get full text |
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Summary: | A compression bond is formed between a gold or gold alloy wire (12) and a solder (16) such as lead/tin by forming a head (14) on the wire and forcing the head into a pad of the solder by thermosonic, or thermocompression, or ultrasonic compression bonding techniques. This forms a gold/solder intermetallic compound which in turn forms the bond. The head of the wire is maintained out of contact with any underlying surface, and surrounded by the solder. |
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Bibliography: | Application Number: EP19890118870 |