Method of bonding gold or gold alloy wire to solder

A compression bond is formed between a gold or gold alloy wire (12) and a solder (16) such as lead/tin by forming a head (14) on the wire and forcing the head into a pad of the solder by thermosonic, or thermocompression, or ultrasonic compression bonding techniques. This forms a gold/solder interme...

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Bibliographic Details
Main Authors STARR, STEPHEN G, CONRU, H. WARD, GONS, STEPHEN E, WARD, WILLIAM C, OSBORNE, GORDON C. JR, PHELPS, DOUGLAS W., JR
Format Patent
LanguageEnglish
French
German
Published 02.05.1990
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CURRENT COLLECTORS
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A compression bond is formed between a gold or gold alloy wire (12) and a solder (16) such as lead/tin by forming a head (14) on the wire and forcing the head into a pad of the solder by thermosonic, or thermocompression, or ultrasonic compression bonding techniques. This forms a gold/solder intermetallic compound which in turn forms the bond. The head of the wire is maintained out of contact with any underlying surface, and surrounded by the solder.
Bibliography:Application Number: EP19890118870