A multilayered metallurgical structure for an electronic component

Disclosed is a multilayered metallurgical structure for an electronic component. The structure includes a base metallurgy layer (58) which includes one or more layers of chromium, titanium, zirconium, hafnium, niobium, molybdenum, tantalum, copper and/or aluminum. Directly on the base metallurgy is...

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Main Authors PURUSHOTHAMAN, SAMPATH, NARAYAN, CHANDRASEKHAR, COOPER-JOSELOW, ALICE HAVEN, BECKHAM, KEITH FOWLER, AGARWALA, BIRENDRA NATH, RAY, SUDIPTA KUMAR
Format Patent
LanguageEnglish
French
German
Published 11.10.1989
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:Disclosed is a multilayered metallurgical structure for an electronic component. The structure includes a base metallurgy layer (58) which includes one or more layers of chromium, titanium, zirconium, hafnium, niobium, molybdenum, tantalum, copper and/or aluminum. Directly on the base metallurgy is a layer (60) of cobalt. The structure may also include a layer (62) of noble or relatively noble metal such as gold, platinum, palladium and/or tin directly on the cobalt.
Bibliography:Application Number: EP19890480025