Hot melt adhesive containing butene-1 polymers

A hot melt adhesive comprising a blend of: (i) from 10 to 90% by weight of an intimate mixture of (a) an at least partially crystalline copolymer of butene-1 and ethylene, wherein the ethylene content is from 1 to 20 mole percent, and (b) a butene-1 homopolymer, the weight ratio of (a):(b) in said i...

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Bibliographic Details
Main Author MOSTERT, SIMON
Format Patent
LanguageEnglish
French
German
Published 03.05.1989
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
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Summary:A hot melt adhesive comprising a blend of: (i) from 10 to 90% by weight of an intimate mixture of (a) an at least partially crystalline copolymer of butene-1 and ethylene, wherein the ethylene content is from 1 to 20 mole percent, and (b) a butene-1 homopolymer, the weight ratio of (a):(b) in said intimate mixture being from 9:1 to 1:9; (ii) from 90 to 10% by weight of a tackifying resin, the weight percentages of (i) and (ii) being based on their combined weight; and (iii) up to 0.5 parts by weight per 100 parts by weight of (i) and (ii) (phr) of an antioxidant. n
Bibliography:Application Number: EP19880310153