METHOD AND SYSTEM FOR MULTI-LAYER PRINTED CIRCUIT BOARD PRE-DRILL PROCESSING

A method and apparatus for optimizing the drilling position of a multi-layer printed circuit board prior to drilling. A template (115) having precisely located target holes (A',B',C',D') and fixture reference marks (118, 119) provides initial coordinate reference information for...

Full description

Saved in:
Bibliographic Details
Main Authors WILENT, JOHN W, SPARKS, ROBERT A, BENSON, ROBERT F
Format Patent
LanguageEnglish
Published 25.01.1989
Edition4
Subjects
BORING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
TURNING
Online AccessGet full text

Cover

More Information
Summary:A method and apparatus for optimizing the drilling position of a multi-layer printed circuit board prior to drilling. A template (115) having precisely located target holes (A',B',C',D') and fixture reference marks (118, 119) provides initial coordinate reference information for multi-layer printed circuit boards (25) to be inspected by x radiation. Each board (25) is processed by insertion into a holding fixture, examination of four quadrant target areas using x-ray sources (21-24) and detectors (26-29), digitization of the target area images in each quadrant, and computation of the optimum board position in a follow-on drilling apparatus. After optimization, three reference holes are punched along one edge of the board (25) to provide accurate fiducial positioning marks when the board is placed in the drilling apparatus.
Bibliography:Application Number: EP19870308979