FABRICATION OF ELECTRICAL CONDUCTOR BY AUGMENTATION REPLACEMENT PROCESS

Method for applying metal to a substrate which comprises first effecting an augmentation replacement reaction and thereafter increasing the thickness of metal by an electroless plating process. Articles, such as printed circuits, prepared by such process are also provided.

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Bibliographic Details
Main Author KEAN, JOHN, JOSEPH
Format Patent
LanguageEnglish
French
German
Published 08.06.1988
Edition4
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Summary:Method for applying metal to a substrate which comprises first effecting an augmentation replacement reaction and thereafter increasing the thickness of metal by an electroless plating process. Articles, such as printed circuits, prepared by such process are also provided.
Bibliography:Application Number: EP19870900522