FABRICATION OF ELECTRICAL CONDUCTOR BY AUGMENTATION REPLACEMENT PROCESS

• Main Author: KEAN, JOHN, JOSEPH
• Format: Patent
• Language: English; French; German
• Published: 20.01.1988
• Edition: 4
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Un procédé, permettant d'appliquer du métal sur un substrat, consiste d'abord à effectuer une réaction de remplacement par augmentation et ensuite à augmenter l'épaisseur du métal par un procédé de placage sans apport de courant. La présente invention se rapporte également à des articles, tels que des circuits imprimés, préparés grâce audit procédé. Method for applying metal to a substrate which comprises first effecting an augmentation replacement reaction and thereafter increasing the thickness of metal by an electroless plating process. Articles, such as printed circuits, prepared by such process are also provided.