THERMAL PROTECTIVE DEVICE WITH BIMETAL FOR SEMICONDUCTOR DEVICES AND THE LIKE

A thermal protective device for semiconductor devices and the like comprises a housing of electrically insulative plastic material made in cup form having at the open end a seat for lodging a bimetallic disc and means for applying the cup to the semiconductor device with the bimetallic disc in direc...

Full description

Saved in:
Bibliographic Details
Main Authors NOTARO, GIUSEPPE, CALENDA, CIRO, IMBIMBO, FIORENTINO
Format Patent
LanguageEnglish
Published 30.08.1989
Edition4
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A thermal protective device for semiconductor devices and the like comprises a housing of electrically insulative plastic material made in cup form having at the open end a seat for lodging a bimetallic disc and means for applying the cup to the semiconductor device with the bimetallic disc in direct heat exchange relation therewith. One or more electric terminals is incorporated in the housing at the time of molding, and is connected in power supply circuits of the semiconductor device and/or alarm and signaling circuits. The bimetallic disc acts on said electric terminals so as to interrupt or modify the power supply to the semiconductor device or to actuate an alarm signal.
Bibliography:Application Number: EP19860309426