Process and device for welding elements on the corresponding spots of a substrate, such as a high-density integrated-circuit substrate

• Main Authors: VERNON, JEAN-YVES, LE MEAU, MICHEL, BOITEAU, JEAN-PIERRE
• Format: Patent
• Language: English; French; German
• Published: 22.04.1987
• Edition: 4
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING; WELDING; WORKING BY LASER BEAM

Le soudage d'éléments conducteurs (23') sur les plots correspondants (13') d'une plaquette (12') au moyen d'un outil de soudage (19') dont la sole (20') couvre l'ensemble des plots et par application d'une force de soudage prédéterminée sur chacun de...