Process for joining a workpiece to a substrate

An integrated circuit chip is joined to a substrate by first applying solder to the substrate and/or the IC chip, and then applying diol and /or polyol and/or ether derivatives thereof to the substrate. The IC chip is placed in contact with the applied diol/polyol and the resulting assembly is heate...

Full description

Saved in:
Bibliographic Details
Main Authors BRUSIC, VLASTA AGNES, YEH, HELEN LI, SISSENSTEIN, DAVID WILLIAM, JR, OWEN, CHARLES JAMES, ELMGREN, PETER JARL
Format Patent
LanguageEnglish
French
German
Published 18.03.1987
Edition4
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
Online AccessGet full text

Cover

More Information
Summary:An integrated circuit chip is joined to a substrate by first applying solder to the substrate and/or the IC chip, and then applying diol and /or polyol and/or ether derivatives thereof to the substrate. The IC chip is placed in contact with the applied diol/polyol and the resulting assembly is heated in a reducing atmosphere. This process avoids the application of liquid flux compositions and the necessity to remove the flux or flux residues in separate cleaning steps.
Bibliography:Application Number: EP19860109285