SILICON PASTES HAVING A REDUCED CURING TIME
Improved polyorganosiloxane compositions which can be stored with the exclusion of moisture and harden on access to moisture are disclosed. These compositions contain, 100 parts by weight of an alpha , omega -dihdyroxypolydimethylsiloxane, 0 to 100 parts by weight of an alpha , omega -bis(trimethyls...
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Main Authors | , |
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Format | Patent |
Language | English German |
Published |
24.07.1991
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Subjects | |
Online Access | Get full text |
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Summary: | Improved polyorganosiloxane compositions which can be stored with the exclusion of moisture and harden on access to moisture are disclosed. These compositions contain, 100 parts by weight of an alpha , omega -dihdyroxypolydimethylsiloxane, 0 to 100 parts by weight of an alpha , omega -bis(trimethylsiloxy)polydimethylsiloxane plasticizer, 1 to 10 parts by weight of an oximinosilane, 5 to 250 parts by weight of a reinforcing or non-reinforcing filler or a filler mixture, 0.01 to 1 part by weight of a tin catalyst, 0.05 to 2.5 parts by weight of an aminoalkylalkoxysilane and 0.5 to 2.5 parts by weight of an accelerator chosen from alkyl or alkenyl carboxylic acids or silane derivatives of such carboxylic acids. |
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Bibliography: | Application Number: EP19860108698 |