MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

• Main Authors: ITOH, MITSUKO, TOSAKI, HIROMI 406, PAIROT-HAUSU SAN-TOTSUKA, DOKOCHI, HISASHI
• Format: Patent
• Language: English
• Published: 12.08.1987
• Edition: 4
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GLASS; JOINING GLASS TO GLASS OR OTHER MATERIALS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MINERAL OR SLAG WOOL; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS

Disclosed are a multilayer wiring board and a method of manufacturing the same, in which circuits are multilayered using as an insulating material a sintered compact of an oxide mixture obtained by mixing a glass material powder and an inorganic oxide powder so that the inorganic oxide powder may amount to 30 - 50 wt.% of the whole powdery mixture consisting of it and the glass material powder, the glass material powder having a composition of 20 - 30wt.% of SiO2, 18 - 25wt.%, of Al2O3, 18 - 20 wt.% of B2O3, 1 - 6 wt.% of ZnO, 18 - 28 wt.% of BaO, and 1 - 8 wt.% of MgO and Cao in total, and having a mean particle size of 2.0 - 4.0 mu m, the inorganic oxide powder consisting of an Al2O3 powder having a mean particle size of 2.0 - 4.0 mu m and a ZrSiO4 powder having a mean particle size of 2.0 - 4.0 mu m. The multilayer wiring board sintered at a low temperature has a high flexural strength and a high adhesion strength of soldering.