PROCESS FOR STRIPPING PHOTORESIST AND STRIPPING RESTS FROM SEMICONDUCTOR SURFACES
Photoresist and stripper residues can be rapidly and completely removed from semiconductor substrates after the stripping process with an aqueous post-rinsing agent which contains a nonionogenic surfactant and an organic base.
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Main Authors | , |
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Format | Patent |
Language | English German |
Published |
05.06.1991
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Subjects | |
Online Access | Get full text |
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Summary: | Photoresist and stripper residues can be rapidly and completely removed from semiconductor substrates after the stripping process with an aqueous post-rinsing agent which contains a nonionogenic surfactant and an organic base. |
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Bibliography: | Application Number: EP19860100104 |