METHOD FOR PREPARING SEMICONDUCTOR STRUCTURES AND DEVICES WHICH UTILIZE TRENCHES FILLED WITH POLYMERIC DIELETRIC MATERIALS

A method of fabrication of semiconductor structures which utilize trenches filled with polymeric dielectric materials to isolate segments thereof is disclosed. Contamination of the polymeric dielectric during processing of structural segments is avoided by filling the trenches with disposable polyme...

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Bibliographic Details
Main Authors KANDETZKE, STEVEN M, KUTNER, ELLEN LOIS, ARAPS, CONSTANCE JOAN, TAKACS, MARK ANTHONY
Format Patent
LanguageEnglish
Published 15.05.1991
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of fabrication of semiconductor structures which utilize trenches filled with polymeric dielectric materials to isolate segments thereof is disclosed. Contamination of the polymeric dielectric during processing of structural segments is avoided by filling the trenches with disposable polymer through formation of conductive patterns upon the structure, with subsequent removal of the disposable polymer and replacement with the desired polymeric dielectric.
Bibliography:Application Number: EP19850112278