PHOTOSENSITIVE POLYMER COMPOSITION

A photosensitive polymer composition comprising (A) a poly(amic acid), (B) a compound or a mixture of compounds which can form a compound having two or more amino groups in the molecule, and (C) at least one compound having a boiling point of 150 DEG C. or higher at atmospheric pressure and selected...

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Bibliographic Details
Main Authors KOJIMA, MITHUMASA, SHOJI, FUSAJI, KATAOKA, FUMIO, YOKONO, HITOSHI
Format Patent
LanguageEnglish
Published 01.06.1988
Edition4
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:A photosensitive polymer composition comprising (A) a poly(amic acid), (B) a compound or a mixture of compounds which can form a compound having two or more amino groups in the molecule, and (C) at least one compound having a boiling point of 150 DEG C. or higher at atmospheric pressure and selected from the group consisting of wherein Ra, Rb, Rc, m and n are as defined in the specification, has good properties and does not produce cracks on a pattern at the time of development obtained from said composition.
Bibliography:Application Number: EP19840101293