PROCESS FOR FORMING METALLIC IMAGES

Metallic images of uniform quality can be formed on substrates having through-holes by a process using a positive type resist characterized by using as a coating solution for the substrates a solution of a photosensitive material of (a) at least one organic compound having at least one linkage of -M...

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Bibliographic Details
Main Authors NAKATANI, MITSUO, ISOGAI, TOKIO, SAKURAI, HIDEKI, OKA, HITOSHI, YOKONO, HITOSHI
Format Patent
LanguageEnglish
Published 03.04.1985
Edition4
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Summary:Metallic images of uniform quality can be formed on substrates having through-holes by a process using a positive type resist characterized by using as a coating solution for the substrates a solution of a photosensitive material of (a) at least one organic compound having at least one linkage of -M-M-(M)n- (M = Si, Ge or Sn; n = 0,1 or more) in the molecule or (b) a mixture of at least one organic compound (a) mentioned above and at least one photosensitizer, dissolved in a solvent such as a halogenated hydrocarbon, an aromatic hydrocarbon, a heterocyclic compound, or a mixture thereof, followed by irradiation with an actinic light through a photomask and electroless plating.
Bibliography:Application Number: EP19810104764