HUSGENNEMFØRING (KABELFORSKRUNING)
A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional laye...
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Main Authors | , , , |
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Format | Patent |
Language | Danish |
Published |
14.06.2018
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Subjects | |
Online Access | Get full text |
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Summary: | A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the second functional layer including a second device portion, and a second encapsulating layer encapsulating the second functional layer. |
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Bibliography: | Application Number: DK20130829083T |