HUSGENNEMFØRING (KABELFORSKRUNING)

A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional laye...

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Bibliographic Details
Main Authors LIGER, Matthieu, YAMA, Gary, CHEN, Po-jui, GRAHAM, Andrew
Format Patent
LanguageDanish
Published 14.06.2018
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Summary:A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the second functional layer including a second device portion, and a second encapsulating layer encapsulating the second functional layer.
Bibliography:Application Number: DK20130829083T