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A pressure sensitive adhesive composition is provided that includes a pressure sensitive adhesive polymer. The polymer includes: at least one copolymerized monoethylenically unsaturated (meth)acrylic acid ester monomer, wherein the (meth)acrylic acid ester monomer, when homopolymerized, has a Tg of...

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Bibliographic Details
Main Authors ZHU, DONG-WEI, LUCAST, DONALD, H
Format Patent
LanguageDanish
Published 21.01.2008
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Summary:A pressure sensitive adhesive composition is provided that includes a pressure sensitive adhesive polymer. The polymer includes: at least one copolymerized monoethylenically unsaturated (meth)acrylic acid ester monomer, wherein the (meth)acrylic acid ester monomer, when homopolymerized, has a Tg of less than about 25° C.; at least one copolymerized monoethylenically unsaturated reinforcing monomer, wherein the reinforcing monomer, when homopolymerized, has a Tg of at least about 25° C.; covalently bonded quarternary ammonium functionality; and, optionally, at least one copolymerized monoethylenically unsaturated poly(alkylene oxide) monomer. The composition optionally further includes at least one nonreactive poly(alkylene oxide) polymer and/or at least one antimicrobial agent.
Bibliography:Application Number: DK20020786892T