VERFAHREN ZUR HERSTELLUNG EINER MIT KONTAKTEN VERSEHENEN IC-KARTE UND NACH DIESEM VERFAHREN HERGESTELLTE IC-KARTE

The precut (20) is formed directly during the molding of the substrate (12). An independent claim is included for a smart card made as described. Preferred features: The precut is a groove surrounding the inner part of the substrate, where its thickness is reduced. It is a slit (20) interrupted by b...

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Bibliographic Details
Main Author ELBAZ, DIDIER
Format Patent
LanguageGerman
Published 30.10.2008
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:The precut (20) is formed directly during the molding of the substrate (12). An independent claim is included for a smart card made as described. Preferred features: The precut is a groove surrounding the inner part of the substrate, where its thickness is reduced. It is a slit (20) interrupted by bridging sections (22, 24, 26). A starting point for tearing (28) is formed when molding the substrate. On at least one edge of the mini card as defined by the slit, there is a chamfer (32) formed during molding. Pressure injection molding is employed to make the mini card. One bridging section (26) has significant width, injection taking place close to it. Injection takes place at one edge, the main direction of injection being contained in the plane of the substrate and directed towards the bridging section (26). The electronic microcircuit forms part of a module which is carried in a cavity made in the card substrate, this cavity being formed during molding of the substrate.
Bibliography:Application Number: DE19996037635T