HÄRTBARE EPOXIDHARZZUSAMMENSETZUNGEN

Curable epoxy resin compositions, which are obtainable by heating a composition containing at least one epoxy compound, which contains on average at least one, preferably more than one, 1,2-epoxy group and optionally also one or several hydroxyl groups in the molecule, in the presence of at least on...

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Bibliographic Details
Main Authors FISCHER, WALTER, WIESENDANGER, ROLF
Format Patent
LanguageGerman
Published 28.10.2004
Edition7
Subjects
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Summary:Curable epoxy resin compositions, which are obtainable by heating a composition containing at least one epoxy compound, which contains on average at least one, preferably more than one, 1,2-epoxy group and optionally also one or several hydroxyl groups in the molecule, in the presence of at least one Lewis acid as catalyst, wherein the Lewis acid is a salt of trifluoromethanesulfonic acid or of perchloric acid, the counterion of which carries a 2- to 6-fold positive charge, until the epoxy value, measured in equivalent epoxy/kg (Eq/kg) of the starting material, has been reduced by 1 to 60 percent, preferably by 5 to 50 percent; a process for their preparation, and their use for the preparation of fully cured moulded compositions or coatings. Claimed are, inter alia, also high molecular weight epoxy compounds of formula (IIa)wherein A is a divalent aliphatic or aromatic radical, B is the radical of the dioxan, which is substituted either in 2- and 5-position or in 2- and 6-position and which may be in the cis- or trans-form, and n is an integer from 1 to 10, preferably from 1 to 5.
Bibliography:Application Number: DE19996013374T