MIKROSATELLITEN MIT INTEGRIERTEN SCHALTKREISEN

A plurality of silicon and GaAs wafers each including integrated circuitry for providing particular functions for each wafer are mounted within a housing in a stacked, spaced apart, and parallel configuration. Photodetectors and LED's are used to transmit and receive data between opposing wafer...

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Bibliographic Details
Main Author JOSHI, ABHAY M
Format Patent
LanguageGerman
Published 21.09.2006
Subjects
AIRCRAFT
ANTENNAS, i.e. RADIO AERIALS
AVIATION
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COSMONAUTICS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
VEHICLES OR EQUIPMENT THEREFOR
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Summary:A plurality of silicon and GaAs wafers each including integrated circuitry for providing particular functions for each wafer are mounted within a housing in a stacked, spaced apart, and parallel configuration. Photodetectors and LED's are used to transmit and receive data between opposing wafers. In this manner a micro-packaged device or system is obtained for use amongst other things in lightweight miniaturized microsatellites.
Bibliography:Application Number: DE19986033273T