MIKROSATELLITEN MIT INTEGRIERTEN SCHALTKREISEN
A plurality of silicon and GaAs wafers each including integrated circuitry for providing particular functions for each wafer are mounted within a housing in a stacked, spaced apart, and parallel configuration. Photodetectors and LED's are used to transmit and receive data between opposing wafer...
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Main Author | |
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Format | Patent |
Language | German |
Published |
21.09.2006
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Subjects | |
Online Access | Get full text |
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Summary: | A plurality of silicon and GaAs wafers each including integrated circuitry for providing particular functions for each wafer are mounted within a housing in a stacked, spaced apart, and parallel configuration. Photodetectors and LED's are used to transmit and receive data between opposing wafers. In this manner a micro-packaged device or system is obtained for use amongst other things in lightweight miniaturized microsatellites. |
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Bibliography: | Application Number: DE19986033273T |