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A photosensitive resin composition comprising (A) a carboxyl group-containing photosensitive resin, (B) an epoxy curing agent of formula (I): wherein R , R , R and R are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 18 carbon atoms, provid...

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Bibliographic Details
Main Authors ITO, TOSHIHIKO, HIRAYAMA, TAKAO, HIRAKURA, HIROAKI, YOSHINO, TOSHIZUMI, SATO, KUNIAKI
Format Patent
LanguageGerman
Published 25.11.2004
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CINEMATOGRAPHY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTED CIRCUITS
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Summary:A photosensitive resin composition comprising (A) a carboxyl group-containing photosensitive resin, (B) an epoxy curing agent of formula (I): wherein R , R , R and R are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 18 carbon atoms, provided that at least one of R , R , R and R is an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 18 carbon atoms; R and R are each independently a hydrogen atom or an alkyl group having 1 or 2 carbon atoms; and n is 0, 1, 2 or 3, and (C) a photopolymerization initiator.
Bibliography:Application Number: DE19986021192T