ZUSAMMENSETZUNG UND VERFAHREN ZUM POLIEREN

Improved compositions for polishing silicon, silica or silicon-containing articles is provided which consists of an aqueous medium, abrasive particles and an anion which controls the rate of removal of silica. The anion is derived from a class of compounds which contain at least two acid groups and...

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Bibliographic Details
Main Authors BRANCALEONI, GREGORY, COOK, LEE MELBOURNE
Format Patent
LanguageGerman
Published 29.11.2001
Edition7
Subjects
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Summary:Improved compositions for polishing silicon, silica or silicon-containing articles is provided which consists of an aqueous medium, abrasive particles and an anion which controls the rate of removal of silica. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of work pieces, as well as products produced by such methods, are also provided.
Bibliography:Application Number: DE19946027165T