Sperrwandausrichtung und Prozessüberwachung für die thermischen Tintenstrahl-Druckköpfe

A thermal ink jet printhead formed of a silicon substrate (11), a thin film resistor layer (13) disposed on the silicon substrate, a patterned metallization layer (15) disposed on the thin film resistor layer for defining a plurality of ink firing resistors (16) in the resistor layer, and a barrier...

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Bibliographic Details
Main Author HOCK, SCOTT W., SAN DIEGO, CA 92128, US
Format Patent
LanguageGerman
Published 27.11.1997
Edition6
Subjects
CORRECTION OF TYPOGRAPHICAL ERRORS
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:A thermal ink jet printhead formed of a silicon substrate (11), a thin film resistor layer (13) disposed on the silicon substrate, a patterned metallization layer (15) disposed on the thin film resistor layer for defining a plurality of ink firing resistors (16) in the resistor layer, and a barrier layer (19) overlying the resistor layer and the metallization layer and having firing chamber openings (21) formed therein. The metallization layer further includes a reference target pattern (51), and the barrier layer further includes a reference opening (53) overlying the target reference pattern which is configured such that the alignment of reference opening relative to the target reference is representative of the alignment of the respective firing chamber openings relative to the associated underlying ink firing resistors.
Bibliography:Application Number: DE19936010138T