Wärmeabführendes Bauteil und damit versehene Halbleitervorrichtung

Disclosed herein is a semiconductor laser provided with a heat radiating component which is improved in heat radiating property. The semiconductor laser comprises a heat radiating component for radiating heat which is generated in operation. In this heat radiating component, a polycrystalline diamon...

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Bibliographic Details
Main Authors NAKAI, TETSUO, IGUCHI, TAKAHISA, NAKAMURA, TSUTOMO
Format Patent
LanguageGerman
Published 07.03.2002
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed herein is a semiconductor laser provided with a heat radiating component which is improved in heat radiating property. The semiconductor laser comprises a heat radiating component for radiating heat which is generated in operation. In this heat radiating component, a polycrystalline diamond layer (3) synthesized by vapor deposition is formed on the upper surface of a stem (4). A semiconductor laser element (1) is brazed/bonded onto the surface of the vapor-deposited polycrystalline diamond layer (3) through a brazing filler metal (2). Also disclosed herein is a heat radiating component having a thermal expansion coefficient being coincident to that of an LSI chip to be mounted thereon, which is excellent in heat radiating property.
Bibliography:Application Number: DE19926031790T