Verfahren zum Herstellen von wärmestrahlender Substraten zum Montieren von Halbleitern und gemäss diesem Verfahren hergestellte Halbleiterpackung

A method for manufacturing heat-radiative substrates on which semiconductor devices such as ICs and transistors are mounted and packages using the substrates, wherein a plurality of CuW or CuMo composite materials obtained by the infiltration method or the mixed powder sintering method are joined to...

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Bibliographic Details
Main Authors OSADA, MITSUO, KOHMOTO, KENICHIRO
Format Patent
LanguageGerman
Published 04.06.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
CASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
PERFORMING OPERATIONS
POWDER METALLURGY
SEMICONDUCTOR DEVICES
TRANSPORTING
WORKING METALLIC POWDER
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Summary:A method for manufacturing heat-radiative substrates on which semiconductor devices such as ICs and transistors are mounted and packages using the substrates, wherein a plurality of CuW or CuMo composite materials obtained by the infiltration method or the mixed powder sintering method are joined together with Cu interposed therebetween. Accordingly, the remaining empty holes within the CuW or CuMo materials are filled sufficiently with Cu, allowing high-quality packages having a successful thermal characteristic to be obtained.
Bibliography:Application Number: DE19916028601T